PCB Footprint Naming Convention

All footprint names should be using ALL CAPS.

Resistors

RES-{package}

Capacitors

Unpolarized (ceramic)

CAPA-{package}

Electrolytic

CAPPR-D{diameter}_L{length}_W{width}

Headers

HDR-{gender}-{pitch}_{rows}X{columns}

Connectors

CONN-{SMD|TH}_{name}

Switches

SW-{SMD|TH}_{lead_count}P-L{length}-W{width}-P{pitch}-LS{}

IC Packages

BGA (Ball Grid Array)

BGA-{ball_count}_L{length}-W{width}-R{rows}-C{columns}-P{pitch}-{corner}

FBGA (Fine-pitch Ball Grid Array)

FBGA-{ball_count}_L{length}-W{width}-R{rows}-C{columns}-P{pitch}-{corner}

SOIC (Small Outline Integrated Circuit)

SOIC-{pin_count}_L{length}-W{width}-P{pitch}-LS{}-{corner}

SOP (Small Outline Package)

SOP-{pin_count}_L{length}-W{width}-P{pitch}-LS{}-{corner}

SOT (Small Outline Transistor)

SOT-{package}_L{length}-W{width}-P{pitch}-{corner}

TSSOP (Thin Shrink Small Outline Package)

TSSOP-{package}_L{length}-W{width}-P{pitch}-{corner}